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datashee t ? product configuration: silicon monolithic integrated circuit the product is not designed for radiation resistance. 1/16 tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co. jp tsz22111 ? 14 ? 001 1ch low side switch ic in-vehicle 1ch low side switch bd1lb500 series (bd1lb500efj-c BD1LB500FVM-C) features built-in overcurrent limiting circuit built-in thermal shutdown circuit (tsd) built-in open load detection circuit (at output off) enables direct control from cmos logic ics, etc. low standby current built-in under voltage lock out circuit built-in diagnostic output (st) terminal low on resistance r ds(on) =350m ? (typ) (v dd =in=5v, ta=25c, i out =0.25a) built-in overvoltage protection( active clamp) for output circuit monolithic power ic in which the control unit (cmos) and power mos fet are incorporated into one chip 1ch low side switch for driving mechanical relay coil aec-q100 qualified (1) (1) grade1 overview bd1lb500 series is an in-vehicle 1ch low side switch. this switch builds in the overcurrent limiting circuit, thermal shutdown circuit, open load detection circuit and under voltage lock out circuit. it also provides the diagnostic output circuit when an abnormality is detected. application in-vehicle application (air conditioners, body devices, meters, etc.) specifications operating voltage range 3.5v to 5.5v on resistance (25c, typ.) 350m ? overcurrent limitation (typ.) 1.50a active clamp energy (25c) 25mj package htsop-j8 4.90mm x 6.00mm x 1.00mm msop8 2.90mm x 4.00mm x 0.90mm basic application circuit (recommendation) (2) when the open detection function is required, an external resistance must be added between drain terminal and source terminal. (3) it is necessary to detect unusual state(st terminal is low) when vdd terminal is opened. msop8 htsop-j8 8 1 2 3 4 7 6 5 logic under voltage lock out open load detection overvoltage protection over current limit drain drain in source(gnd) source (g n d) st 10k v dd vdd n.c. 0.1f (2) rext r l vbat (3)
datasheet d a t a s h e e t 2/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 pin descriptions pin no. symbol function 1 in input terminal; a pull down re sistor is connected internally. 2 st self-diagnostic output terminal; outputs ?l? at detection of overcurrent, at open (in=0v), and in the overheat state. see t he truth table. it is structur ed as coms inverter output circuit. 3,4 source (gnd) ground terminal 5,6 drain output terminal; limits output cu rrent to protect ic when load is short-circuited and current exceeding the overcurrent detection value (0.8a min) flows to the output terminal. 7 n.c. no connect pin 8 vdd power supply terminal cooling tab (1) tab the heat radiation metal on the substrate is c onnected to the ic sub. therefore, connect cooling tab to the external gnd electr ical potential (for htsop-j8 only). (1)msop8 does not have cooling tab. pin configurations product name pkg tsd function on resistance (25c,typ) bd1lb500efj-c htsop-j8 self-restart 350m ? BD1LB500FVM-C msop8
datasheet d a t a s h e e t 3/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 absolute maximum ratings item symbol limit values unit drain-source voltage v ds 42 (internally limited) v power supply voltage v dd 7 v diagnostic output voltage v st -0.3 to +7 (1) v output current (dc) i od 0.8 (2) a output current (pulse) i op internally limited (3) a input voltage v in -0.3 to +7 (1) v power consumption pd 2.1(htsop-j8) (4) w 0.587(msop8) (5) operating temperature range t opr -40 t opr +150 c storage temperature range t stg -55 to +150 c maximum junction temperature t jmax 150 c active clamp energy (single pulse) e as 25 (6) mj operating voltage ratings item code limit values unit operating voltage range v dd 3.5 to 5.5 v (1) the condition, v dd v in , v st is required. (2) the value must not exceed pd. (3) internally limited by the overcurrent limiting circuit. (4) when mounting pcb (7070[mm], th ickness 1.6[mm], copper foil area 7070[mm], glass epoxy 2-layer substrate). when using at ta 25c, power dissipation is reduced at 16.8mw/c. (5) when mounting pcb (7070[mm], thic kness 1.6[mm], copper foil area 7070[mm], glass epoxy single-layer substrate). when using at ta 25c, power dissipation is reduced at 4.7mw/c. (6) min active clamp energy at t j(0) = 25c, using single non-repetitive pulse of 0.4a heat dissipation characteristics (htsop-j8) (1) when mounting pcb (7070[mm], th ickness 1.6[mm], copper foil area 7070[mm], glass epoxy 4-layer substrate) when using at ta 25c, power dissipation is reduced at 30mw/c. (2) when mounting pcb (7070[mm], th ickness 1.6[mm], copper foil area 7070[mm], glass epoxy 2-layer substrate) when using at ta 25c, power dissipation is reduced at 16.8mw/c. (msop8) (3) when mounting pcb (7070[mm], thic kness 1.6[mm], copper foil area 7070[mm], glass epoxy single-layer substrate) when using at ta 25c, power dissipation is reduced at 4.7mw/c. 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 0 25 50 75 100 125 150 a [] pd [w] 0.587 w 2.1 w 3.75 w htsop-j8 (1) htsop-j8 (2) msop8 (3)
datasheet d a t a s h e e t 4/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 electrical characteristics (v dd =3.5v to 5.5v, -40c t j + 150c unless otherwise is specified) item symbol limit values unit condition min typ max [power supply block] standby current i dds 0 10 a v dd =5v,v in =0v,v b =12v,r l =47 ? operating current i dd 0.5 1.0 ma v dd =5v,v in =5v,v b =12v,r l =47 ? under voltage lock out threshold voltage v uvlo 2.5 3.0 v [input block] h level input voltage v th1 v dd 0.8 v l level input voltage v th2 v dd 0.2 v input hysteresis v hys 0.40 v high level input current i inh1 50 100 a v in =5v low level input current i inl -1 0 1 a v in =0v [power mos output] output on resistance r ds(on) 350 450 m ? v in =5v, v dd =5v,i d =0.25a,tj=25c r ds(on) 570 750 m ? v in =5v, v dd =5v,i d =0.25a,tj=150c output leak current i l(off) 10 a v in =0v,v ds =12v,tj=25c i l(off) 100 a v in =0v,v ds =12v,tj=150c switching time t on 20 40 s v dd =5v,v in =0v/5v, r l =47 ? t off 20 40 s v dd =5v,v in =0v/5v, r l =47 ? slew rate (at on) dv/dt on 0.5 1 2 v/ s v dd =5v,v in =0v/5v, r l =47 ? slew rate (at off) -dv/dt off 0.5 1 2 v/ s v dd =5v,v in =0v/5v, r l =47 ? output clamp voltage v cl 42 47 52 v v in =0v,i out =-1ma [diagnostic output] diagnostic output voltage ?l level? v stl 0.4 v v dd =5v,v in =5v,i st =0.1ma diagnostic output voltage ?h level? v sth 4.88 v v dd =5v,v in =0v,i st =-0.1ma diagnostic output current ?h level? i sth 10 a v in =0v,v st =5.5v
datasheet d a t a s h e e t 5/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 electrical characteristics (v dd =3.5v to 5.5v, -40c t j + 150c unless otherwise is specified) item symbol rated value unit condition min typ max [protective circuit] overcurrent detection current i ocp 0.8 1.5 2.5 a v in =5v diagnostic output delay time t dhl 40 80 s v dd =5v,r l =4 ? to t dlh 320 640 s v dd =5v,r l = to 4 ? open load detection threshold voltage (1) v open 1 2 3 v in=0v open load detection time t open 100 300 900 s in=0v (1) to enable detection, an external resistance must be added between drain terminal and source terminal. determine rext depending on r l . definition figure 1. definition
datasheet d a t a s h e e t 6/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 measuring circuit diagram figure 3. switching time measuring circuit diagram figure 2. output on resistance measuring circuit diagram figure 4. output clamp voltage measuring circuit diagram figure 5. open detection measuring circuit diagram
datasheet d a t a s h e e t 7/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 diagnostic output truth table v in tj output mode v st output state v out i out h tj 175c(typ) - i out < 1.5a(typ) normal h on i out 1.5a(typ) overcurrent detection l off tj >175c(typ) - - thermal shut down l off l - h (3.0v or more) - normal h off l (2.0v(typ) or less) - open load protection l off
datasheet d a t a s h e e t 8/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 characteristic data (reference data) (v dd =5v, in=5v, tj=25c unless otherwise is specified) figure 6. output on resistance characteristic [temperature characteristic] figure 7. output on resistance characteristic [source voltage characteristic] figure 8. standby current characteristic [source voltage characteristic] figure 9. input current characteristic [input voltage characteristic] 0 100 200 300 400 500 600 700 800 -50 -25 0 25 50 75 100 125 150 [c] output resistance [m ? ] 0.0 2.0 4.0 6.0 8.0 10.0 01234567 v dd [v] i dds [ a] 0 50 100 150 200 01234567 in [v] iin [ a] tj=150c tj=25c tj=-40c 0 100 200 300 400 500 600 700 800 3.0 3.5 4.0 4.5 5.0 5.5 6.0 vdd [v] output resisntance [m ? ]
datasheet d a t a s h e e t 9/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 figure 10. switching time (ton) [temperature characteristic] figure 11. switching time (toff) [temperature characteristic] figure 12. slew rate (at on) [temperature characteristic] figure 13. slew rate (at off) [temperature characteristic] 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 -50 -25 0 25 50 75 100 125 150 tj [c] ton [ s] v dd =3.5v v dd =5.0v v dd =5.5v vdd=4v vdd=12v vdd=18v 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 -50 -25 0 25 50 75 100 125 150 tj [c] toff [ s] 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 150 tj [c] ton [ s] 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 150 tj [c] toff [ s] v dd =3.5v v dd =5.0v v dd =5.5v v dd =3.5v v dd =5.0v v dd =5.5v v dd =5.5v v dd =5.0v v dd =3.5v
datasheet d a t a s h e e t 10/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 switching time measurement timing chart with inductive load figure 16. switching time figure 17.timing chart with inductive load 0 5 10 15 20 25 30 -50 -25 0 25 50 75 100 125 150 tj [c] output leak current [ a] 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 -50-25 0 25 50 75100125150 tj [ ] in [v] on threshold off threshold figure 14. input voltage threshold characteristic [temperature characteristic] figure 15. output leak current [temperature characteristic] (v in =0v) input voltage error flag output voltage output current
datasheet d a t a s h e e t 11/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 protective function timing charts figure 18. overheat protection timing chart figure 19. overcurrent protection timing chart fi gure 20. open detection protection timing chart in v out io st 40s(typ) t off 1ms(typ) 100s(typ) input voltage output current error flag output voltage input voltage chip temperature output current error flag input voltage output voltage error flag v in v out v st t t t 300 s(typ) v out ? 2.0v(typ) (v open ) (t open )
datasheet d a t a s h e e t 12/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 i/o equivalent circuits pin symbol i/o equivalent circuits 1 in 2 st 3.4 source gnd 5,6 drain drain source (gnd) 8 vdd cooling tab tab
datasheet d a t a s h e e t 13/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 ordering information physical dimension tape and reel information marking diagram bd1lb500efj - ce2 pkg efj: htsop-j8 c: high reliability packaging and forming specification e2: embossed tape and reel bd1lb500fvm - cgtr pkg fvm: msop8 c: high reliability g: lead free packaging and forming specification tr: embossed tape and reel msop8(top view) lb5 part number marking lot number 1pin mark 0 0 htsop-j8(top view) lb500e part number marking lot numbe r 1pin mark (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.85 0.05 1.27 0.08 0.08 0.42 +0.05 - 0.04 1.05 0.2 0.65 0.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 5 6 8 (max 5.25 include burr) 7 1 0.545 (3.2) 4.9 0.1 6.0 0.2 (2.4) 3.9 0.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 5 7 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05 ? 0.04 0.6 0.2 0.29 0.15 0.145 +0.05 ? 0.03 4 + 6 ? 4
datasheet d a t a s h e e t 14/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings may dam age the ic. in addition, it is impossible to predict all destructive situations such as short-circuit modes or open circ uit modes. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is expected to be operated in a special mode exceeding the absolute maximum ratings. 2) reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 3) power supply lines design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance val ue when using electrolytic capacitors. 4) source (gnd) voltage the voltage of the source (gnd) pin must be the lowest voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. consider pc that does not exceed pd in actual operating conditions (pc pd). package power dissipation : pd (w)=(tjmax ta)/ ja power dissipation : pc (w)=(vcc vo) io+vcc ib tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package powe r dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current 6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 7) thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn off the ic when the internal temperature of the ic reaches 175c (25c hysteresis). it is not designed to protect the ic from damage or guarantee its operation. do not continue to operate the ic after this function is activated. do not use the ic in conditions where this function will always be activated. 8) over voltage protection (active clamp) there is a built-in over voltage protection circuit (active cl amp) to absorb the induced current when inductive load is off (power mos = off). during active clamp and when in=0v, tsd will not function so keep ic temperature below 150c. 9) over current protection circuit (ocp) the ic incorporates an over-current protection circuit that operates in accordance with the rated output capacity. this circuit protects the ic from damage when the load becomes shorted. it is also designed to limit the output current (without latching) in the event of more than 1.5a (typ) flow, such as from a large capacitor or other component connected to the output pin. this protection circuit is effe ctive in preventing damage to the ic in cases of sudden and unexpected current surges. the ic should not be used in applic ations where the over current protection circuit will be activated continuously. 10) testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic durin g assembly and use similar precautions during transport and storage. 11) regarding input pins of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor.
datasheet d a t a s h e e t 15/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. 12) gnd wiring pattern when using both small-signal and large-current gnd traces, the two ground traces should be routed separately but connected to a single ground at the reference point of t he application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the gnd traces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 13) back electromotive force (bemf) there is a possibility that the bemf is changed by using the operating condition, environment and the individual characteristics of motor. please make sure there is no problem when operating the ic even though the bemf is changed. 14) rush current when power is supplied to the ic, inrush current may flow instantaneously. it is possible that the charge current from the parasitic capacitance of the internal logic may be unstable. therefore, give a special consideration with the power coupling capacitance, power wiring, width of gnd wiring, and routing of connections. 15) tab ic? sub is already connected to tab, please short tab to external gnd. ? resistor transistor (npn) n ? n ? n ? p + ? p + ? p ? p ? substrate ? gnd ? parasitic ? element ? pin ? a ? n ? n ? p + ? p + ? p ? p substrate gnd ? parasitic ? element pin b c ? b ? e ? n ? gnd ? pin ? a ? pin ? b ? other ? adjacent ? elements e ? b ? c ? gnd ? parasitic ? parasitic ? ? example ? of ? monolithic ? ic ? structure
datasheet d a t a s h e e t 16/16 bd1lb500 series tsz02201-0g3g0bd00040-1-2 ? 2015 rohm co., ltd. all rights reserved. 2015.04.01 rev.006 www.rohm.co.jp tsz22111 ? 15 ? 001 revision history date revision changes 01.aug.2013 003 new release 06.aug.2013 004 ? p.11 figure20 v out timing chart is modified. 10.jan.2014 005 ? p4. condition of diagnostic output voltage ?l level? is added. ? p4. item of diagnostic output voltage ?h level? is added. 1.apr.2015 006 ? p1. ?aec-q100 qualified? is added in features ? p1. note (1),(2) and (3) are added ? p2. pin no 7 n.c. is added in pin description ? p2. ?cooling tab?(symbol; tab) is added in pin description ? p3. note (6) is added ? p4. min of ? diagnostic output voltage ?h level? ? is changed to 4.88v ? p9. ?ton? is changed to ?toff? in figure 11. 13. ? p10. figure 17 is changed ? p15. fin is changed to tab in 15)
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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